Breadboard and electronics experimentation system

ABSTRACT

An electronic breadboard system may include a computing device including a display screen. The display screen has a first portion to display an electronic circuit model and a second portion directly adjacent to the first portion. The electronic breadboard system also includes a translucent breadboard on the second portion of the display screen. The translucent breadboard includes a translucent face plate having a rectangular grid of openings exposing a plurality of contacts. The plurality of contacts are arranged lengthwise along each row of the rectangular grid of openings and orthogonal to a transparent back plate coupling the plurality of contacts to the translucent face plate. The electronic breadboard system includes a graphics controller. The graphics controller may illuminate a row opening and/or a column opening of the translucent breadboard to direct placement of electrical components of a computer model in response to user interaction with the electronic circuit model.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims the benefit of U.S. Provisional PatentApplication No. 62/382,528, filed on Sep. 1, 2016, and titled“BREADBOARD AND ELECTRONICS EXPERIMENTATION SYSTEM,” the disclosure ofwhich is expressly incorporated by reference herein in its entirety.

BACKGROUND Field

This application relates to circuit design and, more specifically, to abreadboard and electronics experimentation system.

Background

A breadboard is generally defined as a board for making an experimentalmodel of an electric circuit. In general, the breadboard is used as afoundation to prototype a circuit. That is, a breadboard may be used asa construction base for building a working prototype of an electroniccircuit. The term breadboard is derived from the actual use of a woodenbread board as a construction base for connecting electronic componentsinto an electronic circuit. Today, the term “breadboard” is associatedwith solderless breadboards that enable connection of electricalcomponent pins within solder deposition, which makes these breadboardsreusable. Reusability is important for creating temporary prototypes andexperimenting with circuit design. Solderless breadboards are,therefore, extremely popular with students in technological education.

In operation, the breadboard provides an apparatus to connect variouscircuit elements and power sources together according to an electronicmodel. Conventionally, external test instruments may be connected to thecircuit for determining a circuit characteristic at any particularpoint. Unfortunately, breadboards are passive devices that do notprovide any guidance for interconnecting the circuit components andpower source(s) to build a working prototype. Consequently, wiring ofthe circuit components on the breadboard may be erroneous, leading to amalfunctioning circuit.

SUMMARY

An electronic breadboard system may include a computing device includinga display screen. The display screen has a first portion to display anelectronic circuit model and a second portion directly adjacent to thefirst portion. The electronic breadboard system also includes atranslucent breadboard on the second portion of the display screen. Thetranslucent breadboard includes a translucent face plate having arectangular grid of openings exposing a plurality of contacts. Theplurality of contacts are arranged lengthwise along each row of therectangular grid of openings and orthogonal to a transparent back platecoupling the plurality of contacts to the translucent face plate. Theelectronic breadboard system includes a graphics controller. Thegraphics controller may illuminate a row opening and/or a column openingof the translucent breadboard to direct placement of electricalcomponents of a computer model in response to user interaction with theelectronic circuit model.

A method for using a translucent breadboard may include accessing anelectronic file that provides a description of a plurality of electricalcomponents and a plurality of component connections to form a circuit inwhich a user is experimenting. The method may also include obtaininginformation regarding a size and spacings of openings within thetranslucent breadboard for initializing, registering and/or aligning thetranslucent breadboard on a display screen. The method may furtherinclude mapping the plurality of electrical components and the pluralityof component connections as defined in the electronic file, to a set ofbreadboard openings arranged to expose contacts in individual ones ofthe set of breadboard openings. The method may also include translatingthe set of breadboard openings and the plurality of componentconnections to display coordinates for illuminating traces and spots onthe display screen, in view of the aligning.

A non-transitory computer readable medium comprising instructions, whichwhen executed to perform a method. The method may include sending acircuit wiring connection layout comprising a visual representation ofcircuit elements. The method may also include receiving a selection of acircuit element. The method may further include sending to a displayscreen a signal to illuminate a portion of the display screen beneath atranslucent breadboard indicating where a user should place a selectedcircuit element on the translucent breadboard.

An electronic breadboard system may include a computing device includinga display screen. The display screen has a first portion to display anelectronic circuit model and a second portion directly adjacent to thefirst portion. The electronic breadboard system also includes atranslucent breadboard on the second portion of the display screen. Thetranslucent breadboard includes a translucent face plate having arectangular grid of openings exposing a plurality of contacts. Theplurality of contacts are arranged lengthwise along each row of therectangular grid of openings and orthogonal to a transparent back platecoupling the plurality of contacts to the translucent face plate. Theelectronic breadboard system includes means for illuminating a rowopening and/or a column opening of the translucent breadboard to directplacement of electrical components of a computer model in response touser interaction with the electronic circuit model.

This has outlined, rather broadly, the features and technical advantagesof the present disclosure in order that the detailed description thatfollows may be better understood. Additional features and advantages ofthe disclosure will be described below. It should be appreciated bythose skilled in the art that this disclosure may be readily utilized asa basis for modifying or designing other structures for carrying out thesame purposes of the present disclosure. It should also be realized bythose skilled in the art that such equivalent constructions do notdepart from the teachings of the disclosure as set forth in the appendedclaims. The novel features, which are believed to be characteristic ofthe disclosure, both as to its organization and method of operation,together with further objects and advantages, will be better understoodfrom the following description when considered in connection with theaccompanying figures. It is to be expressly understood, however, thateach of the figures is provided for the purpose of illustration anddescription only and is not intended as a definition of the limits ofthe present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure, referenceis now made to the following description taken in conjunction with theaccompanying drawings.

FIG. 1A is a top view of a configuration of a breadboard, according toaspects of the present disclosure.

FIG. 1B is a short edge view of the breadboard of FIG. 1A, according toaspects of the present disclosure.

FIG. 1C is a long edge view of the breadboard of FIG. 1A, according toaspects of the present disclosure.

FIG. 2A is an exploded view of the contents of the translucentbreadboard of FIG. 1A, according to aspects of the present disclosure.

FIG. 2B is a top view of the translucent breadboard of FIG. 1A,including a side view of the X-contacts, according to aspects of thepresent disclosure.

FIG. 3A is a cross-section view along an edge view of the translucentbreadboard, further illustrating the X-contacts, according to aspects ofthe present disclosure.

FIG. 3B is a top view of the translucent breadboard of FIG. 1A, showingsection A-A′, which is further illustrated in FIG. 3A, according toaspects of the present disclosure.

FIG. 3C is a cross-section view along an edge of the translucentbreadboard, showing X-contacts and Y-contacts within Section B-B′,according to aspects of the present disclosure.

FIG. 3D is an exploded, bottom-up view of the contents of thetranslucent breadboard of FIG. 1A, according to aspects of the presentdisclosure.

FIG. 3E is a 3D view of the translucent breadboard of FIG. 1A, furtherillustrating the X-contacts and the Y-contacts according to aspects ofthe present disclosure.

FIG. 4 provides a 3D view of the translucent breadboard of FIG. 3E,mounted on an exemplary computing device, according to aspects of thepresent disclosure.

FIG. 5A shows a user's eye view of a schematic circuit diagram, as itmight appear on a display of a computing device, according to aspects ofthe present disclosure.

FIGS. 5B, 5C and 5D show a “user's eye” view of the translucentbreadboard affixed to a computing device displaying the circuitschematic diagram of FIG. 5A, according to aspects of the presentdisclosure.

FIGS. 6A-6J show the translucent breadboard of FIG. 3E connected tovarious computing devices and display screens, including laptopcomputers, desktop computers, computer monitors, tablet computers andmobile devices, according to aspects of the present disclosure.

FIG. 7 is a wireframe image showing a user's view of the translucentbreadboard of FIG. 3E used with an example computing device providinginstruction to its user regarding electronic component placement, ingraphical and text formats, according to aspects of the presentdisclosure.

FIG. 8A is a top view of a configuration of a translucent breadboard,according to aspects of the present disclosure.

FIG. 8B is a back view of the breadboard of FIG. 8A, according toaspects of the present disclosure.

FIG. 8C further illustrates the back view of the breadboard of FIG. 8A,according to aspects of the present disclosure.

FIG. 8D is a long edge view of the breadboard of FIG. 8A, according toaspects of the present disclosure.

FIG. 8E further illustrates the back view of the breadboard of FIG. 8A,according to aspects of the present disclosure.

FIGS. 9A-9D are perspective views of the translucent breadboard usedwith a computing device to form an electronic breadboard system,according to aspects of the present disclosure.

FIG. 10 is a flow chart illustrates a method for breadboardexperimentation according to aspects of the present disclosure.

FIG. 11 is a block diagram showing an exemplary wireless communicationsystem in which an aspect of the disclosure may be advantageouslyemployed.

DETAILED DESCRIPTION

The detailed description set forth below, in connection with theappended drawings, is intended as a description of variousconfigurations and is not intended to represent the only configurationsin which the concepts described herein may be practiced. The detaileddescription includes specific details for the purpose of providing athorough understanding of the various concepts. It will be apparent,however, to those skilled in the art that these concepts may bepracticed without these specific details. In some instances, well-knownstructures and components are shown in block diagram form in order toavoid obscuring such concepts.

As described herein, the use of the term “and/or” is intended torepresent an “inclusive OR”, and the use of the term “or” is intended torepresent an “exclusive OR”. As described herein, the term “exemplary”used throughout this description means “serving as an example, instance,or illustration,” and should not necessarily be construed as preferredor advantageous over other exemplary configurations. As describedherein, the term “coupled” used throughout this description means“connected, whether directly or indirectly through interveningconnections (e.g., a switch), electrical, mechanical, or otherwise,” andis not necessarily limited to physical connections. Additionally, theconnections can be such that the objects are permanently connected orreleasably connected. The connections can be through switches. Asdescribed herein, the term “proximate” used throughout this descriptionmeans “adjacent, very near, next to, or close to.” As described herein,the term “on” used throughout this description means “directly on” insome configurations, and “indirectly on” in other configurations.

A breadboard is generally defined as a board for making an experimentalmodel of an electric circuit. That is, a breadboard may be used as aconstruction base for building a working prototype of an electroniccircuit. Unfortunately, breadboards are passive devices that do notprovide any guidance for interconnecting the circuit components andpower source to build a working prototype. Consequently, wiring of thecircuit components on the breadboard may be erroneous, leading to amalfunctioning circuit.

In aspects of the present disclosure, a breadboard of an electronicsexperimentation system allows its user to precisely place electroniccomponents onto the breadboard by using a computing device's displayscreen as a guide to such components' placement. Other configurations ofa breadboard and electronics experimentation system are also described.

In general, aspects of the present disclosure provide a see-through(e.g., translucent) breadboard, and a method and system for using thebreadboard. Specifically, aspects of the present disclosure direct auser's placement of electronic components on a translucent breadboard byusing objects being displayed on a display screen that is immediatelyadjacent and behind the breadboard. The displayed objects are visible tothe user in front of the breadboard.

According to aspects of the present disclosure, a graphical userinterface (“GUI”) is controlled by an electronics simulation andexperimentation program to display visual images (objects) of anelectronic circuit. These displayed objects represent, and may evenresemble, wire traces and electrical components, including theirelectrical terminals or pins that together form the electronic circuit.The electronic circuit is realized once the user inserts the actualelectrical components and wire segments into openings of the breadboardthat are located immediately or directly adjacent to the displayedobjects.

In addition to displaying the electronic circuit, user interaction withthe displayed electronic circuit is tracked for illuminating thelocations (e.g., a row opening and/or a column opening) in thebreadboard where wire segments and components (their terminals or pins)are to be inserted. In this aspects of the disclosure, a mapping processis performed between an electronic component's physical layout and theabstraction represented by the electronic component in the diagramdisplayed by the electronics simulation and experimentation program.Consequently, these locations are easily visible from above thebreadboard, allowing the user to precisely insert the terminals or pinsof the electronic components into the breadboard's face plate.Illuminating the breadboard row/column opening helps guide theelectrical connection of the electronic circuit terminals and wiresegments in a correct manner, which helps reduce connection mistakes.

Thus, an object representing an electrical circuit/network node or traceor component terminal or footprint is displayed on the screen directlyadjacent to the breadboard (and that is also visible to the naked eye bythe breadboard's user). As the user interacts with the displayedelectrical circuit, an area of the display screen directly below thebreadboard is illuminated to provide a visual guide for properly placingthe actual electronic components and wire segments onto the breadboard.That is, circuit is guided by illuminating locations of the translucentbreadboard for placing a circuit element in electrical contact with onesof the contacts by illuminated openings visible to the user through thetranslucent breadboard. In this manner, the placement of components andwire segments on the breadboard is more likely to be accurate.

A breadboard and electronics experimentation system may be composed of atranslucent breadboard and a computing device with a display screen(e.g., a tablet computer running a GUI, a desktop computer connected toa dedicated monitor, or the like). In this arrangement, light from thedisplay screen on one side of the translucent breadboard cansufficiently pass through a transparent back plate of the translucentbreadboard and out the translucent face plate having a rectangular gridof openings. The light from the display screen is visible to a naked eyefor precisely illuminating a set of one or more openings of thetranslucent breadboard.

In this example, the illuminated openings are used for receiving a wiresegment that corresponds to an electrical trace or the componentterminals of an electrical component being inserted into the openings.The display screen may also simultaneously display a circuit schematicin a part of the screen that is not covered by the translucentbreadboard. The electrical trace or component corresponding to the wiresegment and components terminals to be inserted, are highlighted orcontrasted (relative to the rest of the circuit schematic) to build thecircuit schematic. An exemplary breadboard and electronicsexperimentation system is shown, for example, in FIGS. 5B-5D.

As described herein, an electronic component is any physical componentthat is used to affect the movement of electrons. The electroniccomponent includes one or more terminals to connect to other electroniccomponents. For example, the electronic component may be a resistor,capacitor, inductor, transistor, diode, integrated circuit, switch,operational amplifier, voltage source, current source, or any otherelectronic component.

FIG. 1A shows a diagram of the top view of an example translucentbreadboard 100 in accordance with one or more aspects of the presentdisclosure. FIG. 1B shows a short edge view of the translucentbreadboard 100. FIG. 1C shows a long edge view of the translucentbreadboard 100, in aspect of the present disclosure.

As shown in FIG. 1A, the translucent breadboard 100 includes atranslucent face plate 110 having a rectangular grid 120 of firstopenings 102. The first openings 102 are arranged as rows for placementof electronic component pins and wires for forming an electroniccircuit. The translucent face plate 110 also includes the columns 130 ofsecond openings 104 for connecting, for example, a power supply. Thetranslucent breadboard 100 also includes a first two-side femaleconnector 106 and a second two-sided female connector 108. The firstopenings 102 and the second openings 104 of translucent face plate 110may expose contacts as further illustrated in FIGS. 2A and 2B.

FIG. 2A is an exploded view of the contents of the translucentbreadboard 100 of FIG. 1A, according to aspects of the presentdisclosure. In this configuration, the translucent breadboard 100 iscomposed of the translucent face plate 110 (e.g., electrically insulatedplate) having the rectangular grid 120 of the first openings 102 and thecolumns 130 of the second openings 104 formed therein. Althoughdescribed as translucent, it should be recognized that the translucentbreadboard 100 of FIG. 1A may also include a transparent face plate incombination with a transparent back plate 160 to form a transparentbreadboard, according to aspects of the present disclosure.

Referring again to FIG. 2A, the translucent breadboard 100 includes acontact layer that is composed of at least two elongated conductivecontacts in a Y-direction, referred herein as Y-contacts 150. TheY-contacts 150 are each oriented as a column that runs behind thecolumns 130 of the second openings 104 in the translucent face plate110. The Y-contacts 150, which may serve as a power supply rail (e.g., abus strip), are arranged orthogonally to translucent face plate 110 forallowing light from the display screen to emanate from the secondopenings 104. The contact layer also includes several rows ofconductive, elongated contacts (e.g., arranged in an X-directionperpendicular to the Y-direction), referred to herein as X-contacts 140.

In this aspect of the present disclosure, the X-contacts 140 are eachoriented as a row (e.g., 142), behind each respective row of the firstopenings 102 in the rectangular grid 120. In this arrangement, theX-contacts 140 connect to the terminals of electronic components andwire segments installed on the translucent breadboard 100 (e.g.,terminal strips) for forming an electronic circuit. The translucentbreadboard 100 also includes a transparent, electrically insulatingbacking (e.g., a transparent back plate 160) for securing the contactlayer, including the x-contacts 140 and the y-contacts 150 to thetranslucent face plate 110.

In this arrangement, the x-contacts 140 and the y-contacts 150 arearranged orthogonally to the transparent back plate 160 for allowinglight from the display screen to emanate from the first openings 102 andthe second openings 104. In addition, the transparent back plate 160serves to close off a bottom end of the first openings 102 in therectangular grid 120, as well as the second openings in the columns 130.In this example, an opposing face of the translucent face plate 110 isetched to form receptacle channels for retaining the X-contacts 140 andthe Y-contacts 150. In this example, the X-contacts 140 and theY-contacts 150 are held in the translucent plate's receptacle channelsby the transparent back plate 160.

The translucent breadboard 100 may also be configured so that a firstset of the X-contacts 140 that are a subset of a second set of theX-contacts 140 in the translucent breadboard 100 are to be electricallyconnected to a set of connector contacts of a computing device (e.g.,FIGS. 6A to 6J). In this manner, the first set of X-contacts 140 mayserve to electrically connect the terminals of an electronic componentthat has been inserted into the first openings 102 of the translucentbreadboard 100 (which openings are aligned with the first set of theX-contacts 140, respectively), to a computing device (not shown). Thisconnection allows a program running in the computing device tocommunicate with the electronic component that is on the translucentbreadboard 100. The translucent breadboard 100 may be composed ofacrylonitrile butadiene styrene (ABS) plastic, polycarbonate plastic,silicone, glass, or other like material.

FIG. 2B is a top view of the translucent breadboard 100, including aside view of the X-contacts 140 according to aspects of the presentdisclosure. In this arrangement, the X-contacts 140, of the rectangulargrid 120 and the Y-contacts 150 of the columns 130 are orthogonal to thetranslucent face plate 110, such that light emanates through the firstopenings 102 and the second openings 104. As further illustrated in FIG.2B, section A-A′ highlights a subset of rows in the rectangular grid 120to further illustrate the orthogonal arrangement of the X-contacts 140relative to the translucent face plate 110, as further illustrated inFIG. 3A.

FIG. 3A is a cross-section, exploded view of an edge of the translucentbreadboard 100 along section A-A′ of FIG. 3B, showing an electroniccomponent 310 placed on in the first openings 102 and secured by theX-contacts 140, according to aspects of the present disclosure. FIG. 3Bis a top view of the translucent breadboard of FIG. 1A, showing sectionA-A′, which is further illustrated in FIG. 3A, according to aspects ofthe present disclosure.

FIG. 3A is a cross-section of the translucent breadboard 100 (and anenlarged view of section A-A′, shown in FIG. 3B) that diagrams howterminals 312 (e.g., pins) of an electronic component 310 fit within thefirst openings 102 of the translucent face plate 110 for contacting theX-contacts 140 of the translucent breadboard 100. Also shown in FIG. 3Aat A-A′ is the transparent back plate 160 of the translucent breadboard100, which is on the face of a display screen 300 and parallel thereto.It should be recognized that a surface of the transparent back plate 160may or may not abut, but is adjacent to the display screen 300. In thisarrangement, an illuminated object on the display screen indicating, forexample, the location of a trace or the terminals 312 of an electroniccomponent 310 is visible to a user through the first openings 102 withthe naked eye and without the need for magnification, prior toconnecting the electronic component 310.

In the configuration shown in the FIGS. 3A and 3B, the translucentbreadboard 100 includes the translucent face plate 110 fixed to thetransparent back 160. The translucent face plate 110 may be composed ofa translucent, electrically insulating plate having a grid of holes(e.g., the first openings 102) formed therein. The first openings 102 inthe translucent face plate 110 exposes the X-contacts 140 that are fixedto a sidewalls 112 of the first openings 102, within X-receptaclechannels 122 at a base of the first openings 102. The X-contacts 140 maybe oriented as a row behind a respective row of the first openings 102in the rectangular grid 120 connecting the terminals (e.g., 312) of theelectronic components (e.g., 310) and wire segments (not shown)installed on the translucent breadboard 100 (e.g., terminal strips). Inthis configuration, the X-contacts 140 are placed in the X-receptaclechannels 122, orthogonal to the transparent back plate 160 to enablelight from the display screen 300 to emanate from the first openings102.

FIG. 3C is a cross-section view along an edge of the translucentbreadboard 100, showing the X-contacts 140 and the Y-contacts 150 withinSection B-B′, according to aspects of the present disclosure. In thisconfiguration, the Y-contacts 150 are each oriented as a column thatruns behind its respective column of the columns 130 of the secondopenings 104 and that may serve as a power supply rail (e.g., a busstrip). The columns 130 of the second openings 104 are also orthogonalto the rows of the X-contacts 140 within the rectangular grid 120 of thefirst openings 102.

FIG. 3D is an exploded, bottom-up view of the contents of thetranslucent breadboard 100 of FIG. 1A, according to aspects of thepresent disclosure. The translucent breadboard 100 includes thetransparent back plate 160 (e.g., a transparent, electrically insulatingbacking) for securing the contact layer, including the X-contacts 140and the Y-contacts 150 to the translucent face plate 110.

In this arrangement, a bottom face of the translucent face plate 110 isetched to form Y-receptacle channels 132 in which the Y-contacts 150 areretained. The bottom face of the translucent face plate 110 is alsoetched to form X-receptacle channels 122 in which the X-contacts 140 areretained. The X-contacts 140 and the Y-contacts 150 of the contact layerare held in place by within X-receptacle channels 122 and theY-receptacle channels 132 of the translucent face plate 110 by thetransparent back plate 160.

FIG. 3E is a 3D view of the translucent breadboard 100 of FIG. 1A,further illustrating the X-contacts 140 and the Y-contacts 150 accordingto aspects of the present disclosure. Within the translucent face plate110, there are horizontal channels formed as rows of the rectangulargrid 120 of the first openings 102 and vertical channels formed as thecolumns 130 of the second openings 104. The X-contacts 140 line rows ofthe rectangular grid 120 and are exposed by the first openings 102.Similarly, the Y-contacts 150 line the columns 130 and are exposed bythe second openings 104. In this arrangement, the X-contacts 140 and theY-contacts 150 apply pressure upon the abutting terminals of electroniccomponents to secure them within the translucent breadboard 100 bypressing the terminals 312 against channel walls (e.g., sidewalls 112)of the translucent face plate 110, as shown in FIG. 3A.

By contrast, conventional breadboards rely on spring clips that applypressure upon the electronic components' terminals towards a centerpoint behind the breadboard's openings. As a result, conventional springclips do not allow a user to see through such conventional breadboards.In particular, a user is unable to see through conventional breadboardsdue to conventional spring clips, which are composed of horizontallyextended segments (forming opaque rectangles in the back view of aconventional breadboard). That is, a conventional breadboard's springclips pinch a wire or terminal from two sides, towards a center pointbehind the breadboards' openings, with the spring clips' backing platespreventing light from passing through the breadboard.

According to aspects of the present disclosure, the X-contacts 140lining the channeled rows of the rectangular grid 120 and the Y-contacts150 lining the columns 130 in the translucent breadboard 100 are mountedwithin the translucent face plate 110, orthogonal to the transparentback plate 160. In this orthogonal arrangement, the X-contacts 140 andthe Y-contacts 150 are placed at the edges of their planes (e.g.upright), and are shaped to allow light that is coming into thetranslucent breadboard 100 from the transparent back plate 160 to passand through the first openings 102 and/or the second openings 104 in thetranslucent face plate 110. Light from the first openings 102 and/or thesecond openings 104 in the translucent face plate 110 enters into theeyes of a user above the translucent breadboard 100 because theX-contacts 140 and the Y-contacts 150 do not have horizontally extendedsegments of spring contacts, which obscure a user's view throughconventional breadboards.

The user's view through the translucent face plate 110 of thetranslucent breadboard 100 and through the transparent back plate 160 isunobscured, due to the vertically mounted edges of the X-contacts 140and/or the Y-contacts 150. That is, light is able emanate through thetranslucent face plate 110 because X-contacts 140 and/or the Y-contacts150 are formed using a thin strip which does not have a horizontallyextending segment behind the first openings 102 and/or the secondopenings 104 formed in the translucent face plate 110. In other words,the X-contacts 140 and the Y-contacts 150 may be formed as a striphaving a length, a width and a thickness, that is oriented, whilepositioned inside its respective channel (e.g., X-receptacle channels122/Y-receptacle channels 132), so that its width direction is verticalwhile its length direction is horizontal (arranged lengthwise along thechannel), and is sufficiently thin to not obscure the user's view, forexample, as shown in FIG. 3A.

In one configuration, the strip structure of the X-contacts 140 and/orthe Y-contacts 150 does not obscure the base portion of the X-receptaclechannels 122/Y-receptacle channels 132 that is directly behind theterminal of a component or wire segment that is inserted into one of thefirst openings 102 or one of the second openings above the X-receptaclechannels 122/Y-receptacle channels 132. The strip structure of theX-contacts 140 and the Y-contacts 150 allows the user to sufficientlyresolve the periphery of an object that has been illuminated on thedisplay screen 300 directly behind the translucent breadboard 100, asshown in FIG. 3A.

In aspects of the present disclosure, the translucent breadboard 100 isused with a computing device by affixing the translucent breadboard 100to a display screen of the computing device. The translucent breadboard100 is designed to be removed by a user without any tools. In thisarrangement, a portion of the X-contacts 140 and the Y-contacts 150 ofthe translucent breadboard 100 overlay a screen of the computing device.The screen of the computing device may be configured to display agraphical user interface of an electronics experimentation softwareprogram executed by the computing device for non-smartphoneconfigurations. The computing device may be one or more mobile devices,including but not limited to a laptop computer, tablet computer,smartphone, personal digital assistant, or other mobile device.

In one or more configurations, the translucent breadboard 100 does nothave direct or electronically passive connection to a processor of thecomputing device or other circuits of the computing device. In oneconfiguration, a peripheral device is connected between a port (e.g.,universal serial bus (USB) or micro-USB) and the translucent breadboard100. This peripheral device may enable the computing device to accessthe translucent breadboard 100 through general purpose input/output(GPIO) pins of the computing device. Also, in one configuration, notransistor-based devices or other active or passive electroniccomponents are part of or built into the breadboard, and any externalprocessing of the signals of the components on the breadboard occursthrough the connector by the computing device. In other configurations,circuit components such as integrated circuits and passive elements(e.g., capacitors) may be interconnect into circuits using thetranslucent breadboard 100.

FIG. 4 provides a 3D view of the translucent breadboard 100 of FIG. 3E,mounted on a computing device 400, according to aspects of the presentdisclosure. FIG. 4 shows one configuration of the translucent breadboard100, having a first two-side female connector 106 and a second two-sidedfemale connector 108 (e.g., two-side female DB25 connectors) thatprovide a wired electrical connection to a first mating connector 406and a second mating connect 408 (e.g., male DB25 connectors) that arebuilt into a computing device 400. In this example, the translucentbreadboard 100 is affixed to a housing 410 of the computing device 400in which the display screen 420 is also included.

FIG. 5A shows a user's eye view of a circuit schematic diagram 502, asit might appear on a display screen 520 of a computing device 500,according to aspects of the present disclosure. According to aspects ofthe present disclosure, a user is guided in forming a prototype of thecircuit schematic diagram 502 on the translucent breadboard 100. Forexample, a graphics controller of the computing device 500 mayilluminate a row opening and/or a column openings of the translucentbreadboard 100 to direct placement of electrical components of acomputer model in response to user interaction with the electroniccircuit model on the display screen 520.

FIGS. 5B, 5C and 5D show a “user's eye” view of the translucentbreadboard 100 affixed to the computing device 500 displaying thecircuit schematic diagram 502 of FIG. 5A, according to aspects of thepresent disclosure. In this example, the circuit schematic diagram 502is the subject of experimentation. The circuit schematic diagram 502 isdisplayed on a first portion of a display screen 520 within a housing510 of the computing device 500. In this example, the translucentbreadboard 100 is fitted to the lower right corner of the computingdevice 500, overlying a second portion of the display screen 520,adjacent to the first portion.

In FIG. 5B, two bars 530 are displayed on the display screen 520, belowthe translucent breadboard 100. In this example, the two bars 530indicate the locations where two terminals of an electrical componentthat is highlighted in the circuit schematic diagram 502, are to beinserted by the user. The two bars 530 displayed on the display screen520 are visible through the first openings (e.g., 102) of thetranslucent breadboard 100. That is, light emanating from the firstopenings is apparent to the user while looking downward at the top faceof the breadboard. In FIGS. 5C and 5D, an electronic component 540 isaffixed to an illuminated row of the translucent breadboard 100.

In these examples, the translucent breadboard 100 is configured to beaffixed by its user to the computing device 500 and is to beelectrically connected to the computing device with a connector 550 thatis affixed to or integrated into the computing device 500. In addition,at least a portion of the X-contacts 140 and/or the Y-contacts 150 ofthe translucent breadboard 100 overlay the second portion of the displayscreen 520 of the computing device 500. The second portion is adjacentto the second portion of the display screen 520, displaying a graphicaluser interface (“GUI”) of an electronics experimentation softwareprogram executed by the computing device 500.

FIGS. 6A-6J show the translucent breadboard 100 connected to variouscomputing devices and display screens, including laptop computers,desktop computers, computer monitors, tablet computers and mobiledevices, according to aspects of the present disclosure.

FIGS. 6A and 6B show one configuration of the translucent breadboard 100configured for use with a laptop computer 600 through a wired connection650, according to aspects of the present disclosure. In this example,the translucent breadboard 100 is shown using the wired connection 650to the laptop computer 600. In FIG. 6A, the translucent breadboard 100is mounted to the display screen 620 at a corner of the housing 610 ofthe laptop computer 600. In FIG. 6B, the translucent breadboard 100 ismounted to the display screen 620 at an edge of the housing 610. Inthese examples, the wired connection 650 is provided using a USB(universal serial bus) cable connected to a USB port of the laptopcomputer 600. This example shows four wires (e.g., voltage (V), ground(G), and differential data signals (D+ and D−)) connected between thetranslucent breadboard 100 and the USB port of the laptop computer 600.

FIGS. 6C and 6D show one configuration of the translucent breadboard 100configured for use with a desktop computer 660 through the wiredconnection 650, according to aspects of the present disclosure. In thisexample, the translucent breadboard 100 is shown using the wiredconnection 650 to the desktop computer 660. In FIG. 6C, the translucentbreadboard 100 is mounted to the display screen 620 at a corner of thehousing 610 of the desktop computer 660. In FIG. 6D, the translucentbreadboard 100 is mounted to the display screen 620 at an edge of thehousing 610. In these examples, the wired connection 650 is alsoprovided using a USB cable connection to the USB port of the desktopcomputer 660.

FIGS. 6E, 6F and 6G show configurations of the translucent breadboard100 configured for use with a tablet computer 670 through a wiredconnection 655, according to aspects of the present disclosure. In theseexamples, the translucent breadboard 100 is shown using the wiredconnection 655 to the tablet computer 670. In FIG. 6E, the translucentbreadboard 100 is mounted to the display screen 620 at a bottom rightcorner of the housing 610. In FIG. 6F, the translucent breadboard 100 ismounted to the display screen 620 at a right, bottom edge of the housing610. In FIG. 6G, the translucent breadboard 100 is also mounted to thedisplay screen 620 at a right, bottom edge of the housing 610. In theseexamples, the wired connection 655 is provided using a micro-USB cableconnection to a micro-USB port of the tablet computer 670.

FIGS. 6H, 6I and 6J show configurations of the translucent breadboard100 configured for use with a smartphone 680 through the wiredconnection 655, according to aspects of the present disclosure. In theseexamples, the translucent breadboard 100 is also shown using the wiredconnection 655 to the smartphone 680. In FIG. 6H, the translucentbreadboard 100 is mounted to the display screen 620 at a bottom rightcorner of the housing 610. In FIG. 6I, the translucent breadboard 100 ismounted to the display screen 620 at a right, upper edge of the housing610. In FIG. 6J, the translucent breadboard 100 is also mounted to thedisplay screen 620 at a right, top edge of the housing 610. In theseexamples, the wired connection 655 is also provided using a micro-USBcable connection to a to a micro-USB port of the smartphone 680.

In at least one configuration, the translucent breadboard 100 isconnected by wires on one end of the wired connection (e.g., a cable).The other end of the wired connection may be a multi-connector, digitalcommunication cable, such as a USB connector. In this example, as aseparate connector at the other end of the wired connection electricallyconnects a subset of the X-contacts and the Y-contacts (not shown) ofthe translucent breadboard 100 (FIGS. 6A to 6J). In at least oneconfiguration, a multi-conductor, digital communications cable has aconnector at one end that mates with a built-in connector of thecomputing device, and such cabling is housed (e.g., permanentlyattached) within the translucent breadboard 100. The other end iselectrically connected to desired X-contacts and Y-contacts (not shown)on the breadboard (FIGS. 6G, 6H and 6I).

In one aspect of the present disclosure, the various computing devices(e.g., 600, 660, 670, 680) direct placement of the translucentbreadboard 100 as follows. A breadboard placement process may begin byilluminating alignment points for placing the translucent breadboard onthe display screen. In this example, the user aligns two demarcatedpoints that are shown on the GUI as illuminated pixels on the displayscreen 620 that are visible to the user through the face plate of thetranslucent breadboard 100. Once aligned, the user can press a “Forward”button on the screen to indicate that the alignment process is complete.

While FIGS. 6A to 6J described various wired connections between thetranslucent breadboard 100 and the computing devices, aspects of thepresent disclosure are not limited to these wired connections. Forexample, the translucent breadboard 100 may be communicably coupled to aserver associated with the computing device, using a wireless connection(e.g., a Wi-Fi connection). In this example, a wireless connection maybe used to direct layout placement of the translucent breadboard 100 onthe display screen of the computing device. This process may be used toenable the computing device to detect the location of the translucentbreadboard on a display screen. In addition, user interaction with acircuit schematic may be communicated to the computing device via theassociated server to enable illumination of the openings within thetranslucent breadboard for electronic component and wire placement.

In at least one configuration, an electronic experimentation softwarebeing executed by the computing device (e.g., 600, 660, 670, 680) allowsthe user to create, edit, save, and load circuit diagrams from files,either residing on a local disk or available through any standardnetwork socket or protocol (e.g., transmission control protocol (TCP),user datagram protocol (UDP), etc.). The user may add and removeschematic elements, and assemble them into circuits which can be testedand probed virtually. When the components that make up a circuit (i.e.,the wires, sensors, chips, capacitors, resistors, etc.) are assembledinto a circuit, and the circuit is working, then the software may allowthe user to create a physical representation of the circuit on thetranslucent breadboard 100. For example, the software may present theuser with a series of steps to create a working circuit on thetranslucent breadboard 100. This may be achieved, for example, byconveying a series of steps to the user, each step detailing either theplacement of a component or the placement of an end of a wire into thetranslucent breadboard 100.

According to aspects of the present disclosure, the placement of acomponent or the placement of an end of a wire into the translucentbreadboard 100 is specified by illuminating pixels on the display screen620 beneath the row(s) of openings in the translucent breadboard 100into which a component or wire ends are placed. The user may beoptionally presented with contextual information regarding the specificsof the orientation of a component. For example, this information may bepresented visually, as text, or in combination. Once the completecircuit schematic is arranged on the translucent breadboard 100, theelectronic experimentation software may receive a circuit characteristicfrom the translucent breadboard, by obtaining a measurement associatedwith the circuit characteristic. In this example, an oscilloscope may beintegrated within an enclosure for attached the translucent breadboardto the computing device, for obtaining the measurement.

FIG. 7 is a wireframe image of the translucent breadboard 100 used witha computing device 700 to form an electronic breadboard system,according to aspects of the present disclosure. FIG. 7 shows a user'sview of the translucent breadboard 100 attached to a housing 710 of thecomputing device 700. In this example, instructions are provided to theuser for placing electronic components in the rectangular grid 120 ofthe first openings 102 and/or the columns 130 of the second openings 104of the translucent face plate of the translucent breadboard 100. Asshown in the portion of a display screen 720 adjacent to the translucentbreadboard 100, the user is directed to “Connect a wire from <component><pinout> to the highlighted row on the breadboard” in text format. Thetext may be generated by an algorithm or the text may be overwritten byconfiguration in a schematic file. The user responds by placing circuitelements within one of the first openings 102 in the highlighted row 142illuminated by points visible to the user through the translucent faceplate of the translucent breadboard 100. (See FIGS. 5B, 5C and 5D).

FIG. 8A is a top view of a configuration of a translucent breadboard800, according to aspects of the present disclosure. FIG. 8B is a backview of the translucent breadboard 800 of FIG. 8A, according to aspectsof the present disclosure. FIG. 8C further illustrates the back view ofthe translucent breadboard 800 of FIG. 8A, according to aspects of thepresent disclosure. FIG. 8D is a long edge view of the translucentbreadboard of FIG. 8A, according to aspects of the present disclosure.FIG. 8E further illustrates the back view of the translucent breadboardof FIG. 8A, according to aspects of the present disclosure.

As shown in FIG. 8A, the translucent breadboard 800 also includes atranslucent face plate 810 having a first rectangular grid 820-1 and asecond rectangular grid 820-2 of first openings 102 (e.g., two columnsand 38 rows for placement of electronic components). The firstrectangular grid 820-1 and the second rectangular grid 820-2 may beseparated by a ravine in a dual in-line package configuration. The firstopenings 802 are arranged as rows for placement of electronic componentpins and wires for forming an electronic circuit. The translucent faceplate 810 also includes the columns 830 of second openings 104 forconnecting, for example, a power supply (e.g., power and ground rails).In this configuration, the columns 830 are coupled to power/groundfemale pin openings 870 (e.g., pogo pins) for connecting the columns 830to a power rail and a ground rail of a computing device (see FIG. 9A).

FIG. 8A illustrates various dimensions of the translucent breadboard800, according to aspects of the present disclosure. In thisconfiguration, the translucent breadboard 800 is rectangular shaped,having a length of approximately one-hundred thirty millimeters and awidth of ninety two millimeters (e.g. 130 millimeters by 90millimeters). Dimensions of the first rectangular grid 820-1 and thesecond rectangular grid 820-2, the columns 130, and dimensions of thecolumns 130 relative to an edge of a display screen (e.g, edge of liquidcrystal display (LCD) 816).

The translucent breadboard 800 also includes a cutout portion 812 to aidin aligning the translucent breadboard 800 on a display screen of thecomputing device, for example, as shown in FIG. 8A. In oneconfiguration, the translucent breadboard 800 includes a lock 814 forsecuring to a housing of the computing device. An outline of a clearadhesive backing sheet 860 of the translucent breadboard 800 is alsoshown. FIG. 8B is a back view of the translucent breadboard 800 of FIG.8A, further illustrating the clear adhesive backing sheet 860, accordingto aspects of the present disclosure. In this arrangement, the clearadhesive backing sheet 860 includes an adhesive layer for adhering to adisplay screen of a computing device. In this example, the clearadhesive backing sheet 860 has a thickness of approximately 0.25millimeters.

In contrast the first two-side female connector 106 and the secondtwo-sided female connector 108 of the translucent breadboard 100 shownin FIGS. 1A-1C, the translucent breadboard 800 also includes female pins880 (e.g., pogo pins) for connecting to a computing device. The femalepins 880 may include a first column of front-side female pin openings882 and a second column of backside female pin openings 884. Thefront-side female pin openings 882 may be connected to the firstrectangular grid 820-1 and the second rectangular grid 820-2 to enablediagnostic reading of any of the electronic components attached to anyof the first openings 802. The backside view of the translucentbreadboard 800 of FIG. 8A, including the backside female pin openings884, is further illustrated in FIG. 8C.

FIG. 8C further illustrates the back view of the translucent breadboard800 of FIG. 8A, according to aspects of the present disclosure. In thisarrangement, each of the backside female pin openings 884 iselectrically coupled to one of the front-side female pin openings 882through one of the pin contacts 890, which are further illustrated inFIG. 8E. The clear adhesive backing sheet 860, in this example, is shownas having a rectangular shape with a length of one-hundred tenmillimeters and a width of eighty-five millimeters (e.g., 110millimeters by 85 millimeters). In addition, as shown in FIG. 8D, athickness of the translucent breadboard 800 may be five (5) millimeters.A slot depth for inserting orthogonal contacts is shown as 3.2millimeters, as further illustrated in FIG. 8E.

FIG. 8E further illustrates the back view of the translucent breadboardof FIG. 8C, according to aspects of the present disclosure. In thisaspect of the present disclosure, as show in FIG. 8A, the first openings802 and the second openings 804 of translucent face plate 810 may exposethe orthogonal contacts shown in FIG. 8E.

In the arrangement shown in FIG. 8E, the pin contacts 890 coupling thebackside female pin openings 884 to the front-side female pin openings882 are orthogonal to the translucent face plate 810, such that lightemanates through the front-side female pin openings 882. Within thetranslucent face plate 810, there are horizontal slots (see FIG. 8D)formed as rows of the first rectangular grid 820-1 and the secondrectangular grid 820-2 of the first openings 802 and vertical slotsformed as the columns 830 of the second openings 804. The X-contacts 840line rows of the first rectangular grid 820-1 and the second rectangulargrid 820-2, which are exposed by the first openings 802. Similarly, theY-contacts 850 line the columns 830 and are exposed by the secondopenings 104. In this arrangement, pin contacts 890, the X-contacts 840,and the Y-contacts 850 apply pressure upon the abutting terminals ofelectronic components to secure them within the translucent breadboard800 by, for example, pressing the terminals 312 against channel walls(e.g., sidewalls 112) of the translucent face plate 110, as shown inFIG. 3A.

FIGS. 9A-9D are perspective views of the translucent breadboard 800 usedwith a computing device 900 to form an electronic breadboard system,according to aspects of the present disclosure. FIG. 9A shows thetranslucent breadboard 800 attached to a housing 910 of the computingdevice 900 including an alignment pole 912. In this example,instructions may be provided to the user for placing electroniccomponents in the first rectangular grid 820-1 and/or the secondrectangular grid 820-2 of the first openings 802 and/or the columns 830of the second openings 804 of the translucent face plate 810 of thetranslucent breadboard 800. Light from the display screen may illuminatea row of the first openings 802, the second openings 804, and/or thefront-side female pin openings 882, that is visible to the user throughthe translucent face plate 810 of the translucent breadboard 800 forplacing electronic components.

FIG. 9B illustrates a backside of the translucent breadboard 800 furtherillustrating the backside female pin openings 884 as well aspower/ground female pin openings 870 for mating corresponding male pinsof a computing device, for example, as shown in FIG. 9C.

FIGS. 9C and 9D show the translucent breadboard 800, prior to attachmentto the housing 910 of the computing device 900, according to aspects ofthe present disclosure. In this example, the housing of the computingdevice includes the alignment pole 912, a first alignment wall portion914, and a second alignment wall portion 916. The second alignment wallportion 916 is arranged on the housing to mate with the cutout portion812 of the translucent breadboard 800. The housing 910 also includes alock portion 918 corresponding to the lock 814 of the translucentbreadboard 800 for securing to the housing 910 of the computing device900.

In this configuration, the computing device 900 includes malepower/ground pins 970 for mating with the power/ground female pinopenings 870 of the translucent breadboard 800. The computing device 900also includes male pins 980 mating with the female pins 880 of thetranslucent breadboard 800. The male pins 980 and the female pins 880may be configured as pogo pins for enables the computing device 900 toaccess electronic components and circuits affixed to the translucentbreadboard 800. The male pins 980 may be mapped to general purposeinput/output (GPIO) pins of the computing device 900 (e.g., GPIO pins onan Odroid). Diagnostic analysis of the circuits formed on thetranslucent breadboard 800 may be performed through the GPIO pins of thecomputing device 900.

FIG. 10 is a flow chart illustrates a method 1000 for breadboardexperimentation according to aspects of the present disclosure. In oneconfiguration, the method 1000 for using of the breadboard has variousoperations indicated in the flow chart of FIG. 10, noting that some ofthese operations may be performed out of the order indicated below.

At block 1002, a user selects an electronic file residing on a computingdevice or server through a GUI. This file may provide a description ofan electronic circuit, including the constituent electrical componentsand their connections that form the circuit in which the user isexperimenting. For example, a component listed in the file may beidentified by a unique reference number that is specific to theparticular circuit defined by the file (e.g., IC4, R5), and by either acommonly recognized name or part number, (e.g. LM555), or by itselectrical characteristics (e.g., 2.2 k Ohms ¼ W).

At block 1004, the computing device (executing software) may beconfigured to represent the opening size and opening spacing of thetranslucent breadboard (e.g., 0.1 inch or 2.54 mm). For example, asshown in FIGS. 3E, 7, and 8A-8E, dimensions and locations of therectangular grid 120 of the first openings 102 and the columns 130 ofthe second openings 104 in the translucent face plate 110 of thetranslucent breadboard 100 (or 800) are provided to the executingsoftware. This information is used for initializing, registering, and/oralignment of the translucent breadboard 100 on the display screen 720,as driven by a GUI. For example the position of the rectangular grid 120of the first openings 102 and the columns 130 of the second openings 104is translated into pixels or display coordinates of the display screenby the executing software. This may include sending a circuit wiringconnection layout composed of a visual representation of circuitelements.

Referring again to FIG. 10, at block 1006, the selected file is parsedby the computing device, and the electrical components and theirconnections (or the circuit/network nodes, listed in the file) are thenmapped to connections between individual ones of the set of breadboardopenings. For example, as shown in FIGS. 3E and 7, the electricalcomponents and their connections (e.g., made either through theterminals of electronic components or through electrical traces definedby the circuit) are mapped to the rectangular grid 120 of the firstopenings 102 and/or the columns 130 of the second openings 104 in thetranslucent face plate 110.

At block 1008, the mapped set of breadboard openings and the connectionsbetween the mapped breadboard openings are translated by the computingdevice in view of the alignment of the breadboard. The translation ofthe openings is performed into display coordinates for illuminatingobjects (e.g., traces and spots) on the display screen. For example, asshown in FIG. 7, illuminating the highlighted row 142 results in theuser easily insert the correct electrical component terminals or wiresegments into the correct openings of the translucent breadboard 100that are aligned with the illuminated objects. In this example, thecomputing device displays the location of the placement of a circuitelement through the translucent face plate 110 of the translucentbreadboard 100 that is distal to the user. The location of placement isvisible to the user with the naked eye without magnification throughtranslucent face plate 110 of the translucent breadboard 100 that isproximal to the user. To do so, an alignment process may be needed asdescribed above.

These processes described are exemplary, however, and other processesmay also be used to enable circuit experimentation on the translucentbreadboard 100. For example, this process may include sending a circuitwiring connection layout comprising a visual representation of circuitelements to the display screen by the computing device. This processalso includes receiving a selection of a circuit element from the user.The process further includes sending to the display screen a signal toilluminate a portion of the display screen beneath a translucentbreadboard indicating where a user should place the selected circuitelement on the translucent breadboard.

According to a further aspect of the present disclosure, a translucentbreadboard used with a computing device to form an electronic breadboardsystem is described. The electronic breadboard system may include meansilluminating a row opening and/or a column opening of the translucentbreadboard to direct placement of electrical components of a computermodel in response to user interaction with the electronic circuit model.The means for illuminating may, for example, include a graphiccontroller of the computing device shown in FIGS. 9A and 9B. In anotheraspect, the aforementioned means may be any layer, module, or anyapparatus configured to perform the functions recited by theaforementioned means.

FIG. 11 is a block diagram showing an exemplary wireless communicationsystem 1100 in which an aspect of the disclosure may be advantageouslyemployed. For purposes of illustration, FIG. 11 shows three remote units1120, 1130, and 1150 and two base stations 1140. It will be recognizedthat wireless communication systems may have many more remote units andbase stations. Remote units 1120, 1130, and 1150 include IC devices1125A, 1125C, and 1125B that include the disclosed IC device. It will berecognized that other devices may also include the disclosed IC device,such as the base stations, switching devices, and network equipment.FIG. 11 shows forward link signals 1180 from the base station 1140 tothe remote units 1120, 1130, and 1150 and reverse link signals 1190 fromthe remote units 1120, 1130, and 1150 to base station 1140.

In FIG. 11, remote unit 1120 is shown as a mobile telephone, remote unit1130 is shown as a portable computer, and remote unit 1150 is shown as afixed location remote unit in a wireless local loop system. For example,the remote units may be a mobile phone, a hand-held personalcommunication systems (PCS) unit, a portable data unit such as apersonal data assistant, a GPS enabled devices, a navigation device, aset top box, a music player, a video player, an entertainment unit, afixed location data unit such as meter reading equipment, or otherdevices that store or retrieve data or computer instructions, orcombinations thereof. Although FIG. 11 illustrates remote unitsaccording to the aspects of the disclosure, the disclosure is notlimited to these exemplary illustrated units. Aspects of the disclosuremay be suitably employed in many devices, which include the disclosed ICdevice.

For a firmware and/or software implementation, the methodologies may beimplemented with modules (e.g., procedures, functions, and so on) thatperform the functions described herein. Machine-readable medium tangiblyembodying instructions may be used in implementing the methodologiesdescribed herein. For example, software codes may be stored in a memoryand executed by a processor unit. Memory may be implemented within theprocessor unit or external to the processor unit. As used herein, theterm “memory” refers to types of long term, short term, volatile,nonvolatile, or other memory and is not to be limited to a particulartype of memory or number of memories, or type of media upon which memoryis stored.

If implemented in firmware and/or software, the functions may be storedas one or more instructions or code on a computer-readable medium.Examples include computer-readable media encoded with a data structureand computer-readable media encoded with a computer program.Computer-readable media includes physical computer storage media. Astorage medium may be an available medium that can be accessed by acomputer. By way of example, and not limitation, such computer-readablemedia can include RAM, ROM, EEPROM, CD-ROM or other optical diskstorage, magnetic disk storage or other magnetic storage devices, orother medium that can be used to store desired program code in the formof instructions or data structures and that can be accessed by acomputer; disk and disc, as used herein, includes compact disc (CD),laser disc, optical disc, digital versatile disc (DVD), floppy disk andBlu-ray disc where disks usually reproduce data magnetically, whilediscs reproduce data optically with lasers. Combinations of the aboveshould also be included within the scope of computer-readable media.

In addition to storage on a non-transitory computer readable medium,instructions and/or data may be provided as signals on transmissionmedia included in a communication apparatus. For example, acommunication apparatus may include a transceiver having signalsindicative of instructions and data. The instructions and data areconfigured to cause one or more processors to implement the functionsoutlined in the claims.

Although the present disclosure and its advantages have been describedin detail, it should be understood that various changes, substitutionsand alterations can be made herein without departing from the technologyof the disclosure as defined by the appended claims. For example,relational terms, such as “above” and “below” are used with respect to asubstrate or electronic device. Of course, if the substrate orelectronic device is inverted, above becomes below, and vice versa.Additionally, if oriented sideways, above and below may refer to sidesof a substrate or electronic device. Moreover, the scope of the presentapplication is not intended to be limited to the particularconfigurations of the process, machine, manufacture, and composition ofmatter, means, methods and steps described in the specification. As oneof ordinary skill in the art will readily appreciate from thedisclosure, processes, machines, manufacture, compositions of matter,means, methods, or steps, presently existing or later to be developedthat perform substantially the same function or achieve substantiallythe same result as the corresponding configurations described herein maybe utilized according to the present disclosure. Accordingly, theappended claims are intended to include within their scope suchprocesses, machines, manufacture, compositions of matter, means,methods, or steps.

Those of skill would further appreciate that the various illustrativelogical blocks, modules, circuits, and algorithm steps described inconnection with the disclosure herein may be implemented as electronichardware, computer software, or combinations of both. To clearlyillustrate this interchangeability of hardware and software, variousillustrative components, blocks, modules, circuits, and steps have beendescribed above generally in terms of their functionality. Whether suchfunctionality is implemented as hardware or software depends upon theparticular application and design constraints imposed on the overallsystem. Skilled artisans may implement the described functionality invarying ways for each particular application, but such implementationdecisions should not be interpreted as causing a departure from thescope of the present disclosure.

The various illustrative logical blocks, modules, and circuits describedin connection with the disclosure herein may be implemented or performedwith a general-purpose processor, a digital signal processor (DSP), anapplication specific integrated circuit (ASIC), a field programmablegate array (FPGA) or other programmable logic device, discrete gate ortransistor logic, discrete hardware components, or any combinationthereof designed to perform the functions described herein. Ageneral-purpose processor may be a microprocessor, but in thealternative, the processor may be any conventional processor,controller, microcontroller, or state machine. A processor may also beimplemented as a combination of computing devices (e.g., a combinationof a DSP and a microprocessor, multiple microprocessors, one or moremicroprocessors in conjunction with a DSP core, or any other suchconfiguration).

The steps of a method or algorithm described in connection with thedisclosure may be embodied directly in hardware, in a software moduleexecuted by a processor, or in a combination of the two. A softwaremodule may reside in RAM, flash memory, ROM, EPROM, EEPROM, registers,hard disk, a removable disk, a CD-ROM, or any other form of storagemedium known in the art. An exemplary storage medium is coupled to theprocessor such that the processor can read information from, and writeinformation to, the storage medium. In the alternative, the storagemedium may be integral to the processor. The processor and the storagemedium may reside in an ASIC. The ASIC may reside in a user terminal. Inthe alternative, the processor and the storage medium may reside asdiscrete components in a user terminal.

In one or more exemplary designs, the functions described may beimplemented in hardware, software, firmware, or any combination thereof.If implemented in software, the functions may be stored on ortransmitted over as one or more instructions or code on acomputer-readable medium. Computer-readable media includes both computerstorage media and communication media including any medium thatfacilitates transfer of a computer program from one place to another. Astorage media may be any available media that can be accessed by ageneral purpose or special purpose computer. By way of example, and notlimitation, such computer-readable media can include RAM, ROM, EEPROM,CD-ROM or other optical disk storage, magnetic disk storage or othermagnetic storage devices, or any other medium that can be used to carryor store specified program code means in the form of instructions ordata structures and that can be accessed by a general-purpose orspecial-purpose computer, or a general-purpose or special-purposeprocessor. Also, any connection is properly termed a computer-readablemedium. For example, if the software is transmitted from a website,server, or other remote source using a coaxial cable, fiber optic cable,twisted pair, digital subscriber line (DSL), or wireless technologiessuch as infrared, radio, and microwave, then the coaxial cable, fiberoptic cable, twisted pair, DSL, or wireless technologies such asinfrared, radio, and microwave are included in the definition of medium.Disk and disc, as used herein, includes compact disc (CD), laser disc,optical disc, digital versatile disc (DVD), and Blu-ray disc where disksusually reproduce data magnetically, while discs reproduce dataoptically with lasers. Combinations of the above should also be includedwithin the scope of computer-readable media.

The previous description of the disclosure is provided to enable anyperson skilled in the art to make or use the disclosure. Variousmodifications to the disclosure will be readily apparent to thoseskilled in the art, and the generic principles defined herein may beapplied to other variations without departing from the spirit or scopeof the disclosure. Thus, the disclosure is not intended to be limited tothe examples and designs described herein but is to be accorded thewidest scope consistent with the principles and novel features disclosedherein.

What is claimed is:
 1. An electronic breadboard system, comprising: acomputing device comprising a display screen having a first portion todisplay an electronic circuit model and a second portion directlyadjacent to the first portion; a translucent breadboard on the secondportion of the display screen, the translucent breadboard comprising atranslucent face plate having a rectangular grid of openings exposing aplurality of contacts, the plurality of contacts being arrangedlengthwise along each row of the rectangular grid of openings andorthogonal to a transparent back plate coupling the plurality ofcontacts to the translucent face plate; and a graphics controlleradapted to illuminate a row opening and/or a column opening of thetranslucent breadboard to direct placement of electrical components of acomputer model in response to user interaction with the electroniccircuit model.
 2. The electronic breadboard system of claim 1, in whichthe transparent back plate is arranged to directly contact the displayscreen, such that light from the display screen passes through thetransparent back plate and through the plurality of contacts, toilluminate the row opening and/or the column opening within therectangular grid of openings, and wherein the display screen displays agraphical user interface (“GUI”) of an electronics experimentationsoftware program that is to execute in the computing device.
 3. Theelectronic breadboard system of claim 1, wherein the translucentbreadboard is communicable coupled with a server associated with thecomputing device to direct layout placement of the translucentbreadboard on the display screen of the computing device.
 4. Theelectronic breadboard system of claim 1, wherein the translucentbreadboard is electrically coupled with the computing device using awired connection that is affixed to or integrated into the computingdevice.
 5. The electronic breadboard system of claim 1, wherein theplurality of contacts comprise X-contacts arranged to line channeledrows of the translucent face plate and Y-contacts arranged in channeledcolumns within the translucent breadboard, and being retained inX-receptacle channels and Y-receptacle channels on an interior side ofthe translucent face plate, the X-contacts and the Y-contacts, arrangedlengthwise along the column opening and/or the row opening within thetranslucent breadboard.
 6. The electronic breadboard system of claim 5,wherein the X-contacts and the Y-contacts are arranged to presselectronic component terminals to channel walls of the translucent faceplate to secure the terminals to the translucent breadboard.
 7. Theelectronic breadboard system of claim 5, in which the translucentbreadboard comprising a built-in connector and a multi-connector,digital communication cable having separate connectors at its ends, andelectrically coupling a subset of the X-contacts to the computing devicevia the built-in connector.
 8. The electronic breadboard system of claim5 further comprising a multi-conductor, digital communications cable,having a connector at one end electrically coupled to the connector ofthe computing device, and housed within the translucent breadboard andelectrically coupled to the X-contacts and the Y-contacts of thetranslucent breadboard.
 9. The electronic breadboard system of claim 1,wherein the translucent breadboard comprises front-side female pinopenings and backside female pin openings, the front-side female pinopenings adapted to couple to the plurality of contacts to enablediagnostic reading of an electronic component attached to any of therectangular grid of openings.
 10. The electronic breadboard system ofclaim 1, wherein the transparent back plate comprises a clear adhesivebacking sheet.
 11. The electronic breadboard system of claim 1, whereinthe transparent back plate comprises an adhesive layer to adhere thetranslucent breadboard to the display screen of the computing device.12. A method for using a translucent breadboard, comprising: accessingan electronic file that provides a description of a plurality ofelectrical components and a plurality of component connections to form acircuit in which a user is experimenting; obtaining informationregarding a size and spacings of openings within the translucentbreadboard for initializing, registering and/or aligning the translucentbreadboard on a display screen; mapping the plurality of electricalcomponents and the plurality of component connections as defined in theelectronic file, to a set of breadboard openings arranged to exposecontacts in individual ones of the set of breadboard openings; andtranslating the set of breadboard openings and the plurality ofcomponent connections to display coordinates for illuminating traces andspots on the display screen, in view of the aligning.
 13. The method ofclaim 12, further comprising: displaying a location for placing acircuit element through a bottom face of the translucent breadboardbeing distal to the user to illuminate a row/column opening through thetranslucent breadboard being proximal to the user.
 14. The method ofclaim 12, further comprising: illuminating locations of the translucentbreadboard for placing a circuit element in electrical contact with onesof the contacts by illuminated openings visible to the user through thetranslucent breadboard.
 15. The method of claim 12, further comprising;receiving, from the translucent breadboard, a circuit characteristic ata computing device, and obtaining a measurement associated with thecircuit characteristic.
 16. The method of claim 12, further comprising:illuminating alignment points for placing the translucent breadboard onthe display screen; and detecting a response from the user when the usercompletes alignment of the translucent breadboard and computing device.17. A non-transitory computer readable medium comprising instructions,which when executed to perform a method, the method comprising: sendinga circuit wiring connection layout comprising a visual representation ofcircuit elements; receiving a selection of a circuit element; andsending to a display screen a signal to illuminate a portion of thedisplay screen beneath a translucent breadboard indicating where a usershould place a selected circuit element on the translucent breadboard.18. An electronic breadboard system, comprising: a computing devicecomprising a display screen having a first portion to display anelectronic circuit model and a second portion directly adjacent to thefirst portion; a translucent breadboard on the second portion of thedisplay screen, the translucent breadboard comprising a translucent faceplate having a rectangular grid of openings exposing a plurality ofcontacts, the plurality of contacts being arranged lengthwise along eachrow of the rectangular grid of openings and orthogonal to a transparentback plate coupling the plurality of contacts to the translucent faceplate; and means for illuminating a row opening and/or a column openingof the translucent breadboard to direct placement of electricalcomponents of a computer model in response to user interaction with theelectronic circuit model.
 19. The electronic breadboard system of claim18, wherein the transparent back plate comprises a clear adhesivebacking sheet.
 20. The electronic breadboard system of claim 18, whereinthe transparent back plate comprises an adhesive layer to adhere thetranslucent breadboard to the display screen of the computing device.